CONDENSED MATTER PHYSICS - II

Metallic interactions; Kinetic energy; electrostatic; exchange and correlation; Pseudopotential formulation; local and non-local Pseudopotentials; The diffraction model; Factorization of matrix elements; structure factor; Form Factor; Total Energy of the metals; Free electron energy, Band Structure energy; Self consistent screening of a local pseudopotential; Dielectric screening function, Energy wave number Characteristic

(a)Liquid Metal and Alloys                                   
Liquid structure factor s(q); radial distribution function g(r); Relationship between s(q) and g(r); Ziman’s resistivity formula, the role of effective mass on resistivity, Binary liquid metal alloys; Atom-atom partial structure factor; Number concentration description; Thermodynamics in terms of number-concentration correlation functions.  (b)Phase Transformation in Alloys                            
Equilibrium transformation of first and second order, Phase rule, Equilibrium phase diagrams, Interpretation of Phase Diagrams; Substitutional solid solutions, Vegard's law, Interstial Solid Solutions, Hume-Rothery rules, Phase diagrams for binary alloys; Martensitic transitions

Disorder in condensed matter- substitutional, positional and topographical disorder; Short and long-range order; Atomic correlation function and structural descriptions of glasses and liquids; Anderson model; mobility edge; Minimum Metallic Conductivity, Qualitative application of the idea to amorphous semiconductors and hopping conduction

Free electron theory (qualitative idea), variation of density of states with energy, variation of density of state and band gap with size of crystal. Electron confinement in infinitely deep square well, confinement of two and one dimensional well, idea of quantum well structure, tunneling through potential barrier, quantum dots, quantum wires, introduction to fullerenes and graphenes

Different methods of preparation of nanomaterial, Sol-gel and chemical bath deposition method, effect of temperature on the size of the particles. Bottom up: cluster beam evaporation, ion beam deposition, top down: ball milling. DC and RF sputtering.